Midea Showcases Full-Stack Liquid Cooling at Data Centre World Asia

From September 29 to 30, Data Centre World Asia 2026 was held at Marina Bay Sands, Singapore. Midea Building Technologies showcased its full-stack liquid cooling solution for AI data centers, built around self-developed maglev technology and covering the complete chain from cooling source to rack-level terminals. Through real-world applications of its flagship maglev products, Midea demonstrated how full-stack liquid cooling is moving from technical capability to large-scale delivery.

Building on its end-to-end cooling portfolio, Midea also extended into system-level architecture design. Together with CLOU Electronics, it released a new-generation power-cooling integrated architecture and related technical white paper, addressing the industry shift from single-device upgrades to full-system collaborative redesign in the AI era.

01 What Is Happening to Data Center Cooling?

AI computing is pushing data centers into a new phase of higher density, higher power and deeper system coupling. Cooling systems must not only remove heat, but also ensure stable computing output under extreme operating conditions.

• Power density is rising rapidly: Traditional racks operate at 8–15kW, while AI racks have exceeded 300kW and are moving toward 600kW and even 1MW+.
• Air cooling is reaching its limits: Liquid cooling is becoming essential infrastructure, not an optional upgrade.
• Regional conditions are more demanding: In Southeast Asia, high temperature, high humidity, water constraints and energy-efficiency requirements call for localized cooling strategies.

These trends show that cooling, power and energy storage can no longer be designed separately. Data centers must shift from equipment-level selection to cross-system, end-to-end integrated architecture.

02 Full-Stack Liquid Cooling: From Cooling Source to Rack

For data center cooling infrastructure, MBT showcased a full-stack liquid cooling solution that connects the entire chain from cooling source and distribution to terminal heat dissipation. Covering high-efficiency cooling sources, liquid cooling distribution, room-level terminals and digital O&M, the solution supports the high-efficiency cooling demands of AIDC.

Two magnetic levitation flagship products and one high-capacity industrial-grade CDU attracted significant attention:

① Magnetic CDU： As the core product of the solution, the magnetic levitation CDU is built on Midea’s fully self-developed magnetic levitation technology. It integrates the magnetic levitation centrifugal compressor with the CDU, combining cooling source and distribution unit in one system. Compared with traditional solutions, it reduces footprint by over 70% and supports both existing air-cooling scenarios and new liquid-cooling deployments. With prefabricated and modular delivery, the product integrates cooling source, distribution and terminal systems, reducing multi-vendor interface coordination and enabling fast integration into AIDC architectures. It helps shorten project TTM by around 20%, allowing data centers to be built faster and generate computing value earlier. The product has already been deployed at scale in a major cloud data center project in Southeast Asia, validating its delivery efficiency, energy performance and large-scale deployment capability in high-density AI scenarios.

② Air-Cooled Magnetic Centrifugal Chiller：The air-cooled design reduces reliance on cooling water, making it suitable for water-constrained scenarios. Its COP can reach up to 5.4.

③ 2.6MW High-Capacity Industrial CDU: A single unit delivers 2.6 MW of cooling capacity at a 3K temperature difference, supporting heat dissipation for racks above 600 kW, with temperature fluctuation controlled within ±0.5°C.

03 Integrated Architecture: From Device Bundling to System Integration

The new power-cooling integrated architecture jointly launched by MBT and CLOU Electronics highlights a key industry direction: integration for AI data centers is not simple equipment bundling, but system-level design centered on computing demand.

In traditional data centers, energy infrastructure and cooling systems are often planned separately. However, AIDC workloads fluctuate rapidly and heat density continues to rise. Without unified coordination, conflicts may emerge across capacity, space, efficiency and O&M.

The integrated architecture brings critical infrastructure and thermal management into the early design stage, enabling coordinated operation of energy storage, power distribution, cooling and heat dissipation. The white paper, Next-Generation AIDC Power-Storage-Cooling Hyper-Converged Architecture Trend White Paper, defines two practical paths: MGX-compatible evolution for retrofit projects, and rack-side direct supply for new builds. Both paths will coexist and help data centers move from single-point capability to system-level coordination.

04 Midea × Keppel: Accelerating AIDC Cooling Upgrades in Asia

In April this year, Midea Building Technologies signed a strategic cooperation agreement with Keppel’s Infrastructure Division, focusing on AI-enabled, high-efficiency modular cooling solutions. Going forward, the two parties will promote standardized and modular cooling systems across the Asia-Pacific market, providing a reference model for greener operation of high-density data centers.

Built on full-stack liquid cooling, powered by magnetic levitation technology and supported by power-cooling integrated architecture, MBT will continue to provide system-level thermal management and energy solutions for customers in Asia-Pacific and around the world, helping computing infrastructure move toward a greener, lower-carbon and more sustainable future.